CVE-2016-2063
Published Aug 7, 2016
Last updated 4 years ago
Overview
- Description
- Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
- Source
- cve@mitre.org
- NVD status
- Analyzed
Social media
- Hype score
- Not currently trending
Risk scores
CVSS 3.1
- Type
- Primary
- Base score
- 7.8
- Impact score
- 5.9
- Exploitability score
- 1.8
- Vector string
- CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
- Severity
- HIGH
CVSS 2.0
- Type
- Primary
- Base score
- 4.6
- Impact score
- 6.4
- Exploitability score
- 3.9
- Vector string
- AV:L/AC:L/Au:N/C:P/I:P/A:P
Weaknesses
- nvd@nist.gov
- CWE-119
Configurations
[
{
"nodes": [
{
"negate": false,
"cpeMatch": [
{
"criteria": "cpe:2.3:o:linux:linux_kernel:*:*:*:*:*:*:*:*",
"vulnerable": true,
"matchCriteriaId": "CB997E9A-FBEE-415A-9B18-37FCAEA17DB2",
"versionEndIncluding": "3.19.8",
"versionStartIncluding": "3.0"
}
],
"operator": "OR"
}
]
}
]