CVE-2017-18157

Published May 6, 2019

Last updated 6 years ago

Overview

Description
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Source
product-security@qualcomm.com
NVD status
Analyzed

Risk scores

CVSS 3.0

Type
Primary
Base score
7.8
Impact score
5.9
Exploitability score
1.8
Vector string
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Severity
HIGH

CVSS 2.0

Type
Primary
Base score
7.2
Impact score
10
Exploitability score
3.9
Vector string
AV:L/AC:L/Au:N/C:C/I:C/A:C

Weaknesses

nvd@nist.gov
CWE-416

Social media

Hype score
Not currently trending

Configurations