CVE-2018-11277

Published Sep 20, 2018

Last updated 5 years ago

Overview

Description
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Source
product-security@qualcomm.com
NVD status
Analyzed

Risk scores

CVSS 3.0

Type
Primary
Base score
7.8
Impact score
5.9
Exploitability score
1.8
Vector string
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Severity
HIGH

CVSS 2.0

Type
Primary
Base score
4.6
Impact score
6.4
Exploitability score
3.9
Vector string
AV:L/AC:L/Au:N/C:P/I:P/A:P

Weaknesses

nvd@nist.gov
CWE-732

Social media

Hype score
Not currently trending

Configurations