CVE-2019-14037

Published Jul 30, 2020

Last updated 4 years ago

Overview

Description
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
Source
product-security@qualcomm.com
NVD status
Analyzed

Risk scores

CVSS 3.1

Type
Primary
Base score
7.8
Impact score
5.9
Exploitability score
1.8
Vector string
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Severity
HIGH

CVSS 2.0

Type
Primary
Base score
4.6
Impact score
6.4
Exploitability score
3.9
Vector string
AV:L/AC:L/Au:N/C:P/I:P/A:P

Weaknesses

nvd@nist.gov
CWE-416

Social media

Hype score
Not currently trending

Configurations