Overview
- Description
- Memory corruption in DSP Services during a remote call from HLOS to DSP.
- Source
- product-security@qualcomm.com
- NVD status
- Analyzed
Risk scores
CVSS 3.1
- Type
- Primary
- Base score
- 7.8
- Impact score
- 5.9
- Exploitability score
- 1.8
- Vector string
- CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
- Severity
- HIGH
Known exploits
Data from CISA
- Vulnerability name
- Qualcomm Multiple Chipsets Use-After-Free Vulnerability
- Exploit added on
- Dec 5, 2023
- Exploit action due
- Dec 26, 2023
- Required action
- Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Social media
- Hype score
- Not currently trending
Configurations
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