CVE-2023-33063

Published Dec 5, 2023

Last updated 5 months ago

Overview

Description
Memory corruption in DSP Services during a remote call from HLOS to DSP.
Source
product-security@qualcomm.com
NVD status
Analyzed

Risk scores

CVSS 3.1

Type
Primary
Base score
7.8
Impact score
5.9
Exploitability score
1.8
Vector string
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Severity
HIGH

Known exploits

Data from CISA

Vulnerability name
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Exploit added on
Dec 5, 2023
Exploit action due
Dec 26, 2023
Required action
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Weaknesses

nvd@nist.gov
CWE-416
product-security@qualcomm.com
CWE-416

Social media

Hype score
Not currently trending

Configurations